HyperX FURY HX430C15FB3K2/8 memory module 8 GB 2 x 4 GB DDR4 3000 MHz

In Stock

2 x 4GB, 3000MHz, CL15, XMP

  • We give you a dedicated account manager with every order.
  • We welcome single and bulk orders. Get fast delivery each time.
  • We can offer installation and configuration on orders.
  • We care, get great pricing and great customer service.
  • Any further questions, get in touch on 01933 837600.
SKU: HX430C15FB3K2/8
Categories: ,
Brand:

Description

Unleash your style. Unleash your FURY.

HyperX® FURY DDR4 provides a powerful performance boost for gaming, video editing, and rendering with speeds up to 3733MHz. This cost-effective upgrade is available in 2400MHz–3733MHz speeds, CL15–19 latencies, single module capacities of 4GB–32GB, and kit capacities of 16GB–128GB. It features Plug N Play* automatic overclocking at 2400MHz and 2666MHz speeds and is both Intel XMP-ready and Ready for AMD Ryzen. HyperX FURY DDR4 stays cool with its stylish, low-profile heat spreader. 100% tested at speed and backed by a lifetime warranty, it’s an easy, worry-free upgrade for your Intel or AMD-based system.

– Updated low-profile heat spreader design
– Cost-efficient, high-performance DDR4 upgrade
– Intel XMP-ready
– Ready for AMD Ryzen
– Speeds up to 3733MHz and kit capacity up to 128GB
– Plug N Play functionality at 2400MHz and 2666MHz*

* HyperX Plug N Play memory will run in DDR4 systems up to the speed allowed by the manufacturer’s system BIOS. PnP cannot increase the system memory speed faster than is allowed by the manufacturer’s BIOS. HyperX Plug N Play DDR4 products support XMP 2.0 specifications so overclocking can also be achieved by enabling the built-in XMP Profile.

Additional information

Weight 0.1 lbs
Internal memory

8 GB

Memory layout (modules x size)

2 x 4 GB

Internal memory type

DDR4

Memory clock speed

3000 MHz

Component for

PC/Server

Memory form factor

288-pin DIMM

Country of origin

China

Harmonized System (HS) code

84733020

CAS latency

15

Width

7.2 mm

Height

34.1 mm

Operating temperature (T-T)

0 – 85 °C

Cooling type

Heatsink

Depth

133.3 mm

Weight

72.1 g

Package width

13.9 mm

Package depth

95.2 mm

Package height

171.4 mm

Package weight

96.7 g

Master (outer) case width

203.2 mm

Master (outer) case length

311.1 mm

Master (outer) case height

101.6 mm

Master (outer) case gross weight

2.63 kg

Products per master (outer) case

25 pc(s)

Certification

CE

Intel Extreme Memory Profile (XMP)

Yes