Lenovo ThinkSystem SE350 server 480 GB Rack (1U) Intel® Xeon® D D-2143IT 2.2 GHz 32 GB DDR4-SDRAM
Intel Xeon D-2143IT (11MB Cache, 2.2GHz), 32GB DDR4-SDRAM (2666MHz), 480GB SSD, Matrox G200, LAN, 2x 10GbE SFP+
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Description
The ThinkSystem SE350 is a purpose-built server that is half the width and significantly shorter than a traditional server, making it ideal for deployment in tight spaces. It can be mounted on a wall, stacked on a shelf or mounted in a rack. The ThinkSystem SE350 puts increased processing power, storage and network closer to where data is generated, allowing actions resulting from the analysis of that data to take place more quickly.
This product guide provides essential pre-sales information to understand the ThinkSystem SE350 edge server, its key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SE350 and consider its use in IT solutions.
Introduction
The ThinkSystem SE350 is a purpose-built server that is half the width and significantly shorter than a traditional server, making it ideal for deployment in tight spaces. It can be mounted on a wall, stacked on a shelf or mounted in a rack. The ThinkSystem SE350 puts increased processing power, storage and network closer to where data is generated, allowing actions resulting from the analysis of that data to take place more quickly.
Suggested uses: edge computing (IoT, AI, machine learning), retail, video security, inventory management, building control, telecommunications, manufacturing, distribution
Did you know?
Customers looking for computing solutions at the edge of their networks often have to compromise — to use either datacenter-class equipment which is too large and power hungry, or PC based equipment which can’t run their enterprise level applications. The ThinkSystem SE350 fits the space between those two extremes. Its compact design, low power usage, and high performance are just the right combination for edge locations. The SE350 can be wall mounted, stacked on a shelf or installed in a rack. It is also designed to operate in rugged environments, up to 55°C.
Additional information
| Weight | 6.78 lbs |
|---|---|
| Processor family | Intel® Xeon® D |
| Processor manufacturer | Intel |
| Processor model | D-2143IT |
| Processor frequency | 2.2 GHz |
| Processor boost frequency | 3 GHz |
| Processor cores | 8 |
| Processor cache | 11 MB |
| Number of processors installed | 1 |
| Internal memory | 32 GB |
| Internal memory type | DDR4-SDRAM |
| Maximum internal memory | 256 GB |
| Memory slots | 4 |
| ECC | Yes |
| Memory clock speed | 2666 MHz |
| Memory layout (slots x size) | 1 x 32 GB |
| Optical drive type | No |
| On-board graphics card | Yes |
| USB 2.0 ports quantity | 2 |
| USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity | 2 |
| VGA (D-Sub) ports quantity | 1 |
| Chassis type | Rack (1U) |
| Performance management | XClarity Enterprise |
| Trusted Platform Module (TPM) | Yes |
| Trusted Platform Module (TPM) version | 2.0 |
| Compatible operating systems | Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi |
| Redundant power supply (RPS) support | Yes |
| Width | 209 mm |
| Depth | 376 mm |
| Height | 43 mm |
| Ethernet LAN | Yes |
| Cabling technology | 10/100/1000Base-T(X) |
| Product colour | Black |
| Operating temperature (T-T) | 5 – 45 °C |
| Storage temperature (T-T) | -40 – 60 °C |
| Operating relative humidity (H-H) | 8 – 90% |
| Storage relative humidity (H-H) | 5 – 95% |
| On-board graphics card model | Matrox G200 |
| BIOS type | UEFI |
| Number of redundant power supplies installed | 2 |
| Weight | 3.75 kg |
| Thermal Design Power (TDP) | 65 W |
| Processor threads | 16 |
| Total storage capacity | 480 GB |
| Number of SSDs installed | 1 |
| SSD capacity | 480 GB |
| SSD interface | SATA |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2133 MHz |
| Maximum internal memory supported by processor | 512 GB |
| Bus type | UPI |
| CPU configuration (max) | 1 |
| Intel Secure Key Technology version | 1.00 |
| Intel TSX-NI version | 1.00 |
| Harmonized System (HS) code | 84714100 |
| Execute Disable Bit | Yes |
| Embedded options available | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel 64 | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Idle States | Yes |
| Intel Software Guard Extensions (Intel SGX) | No |
| Processor socket | BGA 2518 |
| Processor lithography | 14 nm |
| Processor operating modes | 64-bit |
| Processor codename | Skylake |
| Thermal Monitoring Technologies | Yes |
| Maximum number of PCI Express lanes | 32 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 1S |
| PCI Express slots version | 3.0 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel® Secure Key | Yes |
| Intel TSX-NI | Yes |
| Intel® OS Guard | Yes |
| Processor ARK ID | 136431 |
| Stepping | M1 |
| Processor code | SR3ZU |
| Conflict-Free processor | Yes |
| Intel Enhanced Halt State | Yes |
| Intel QuickAssist Technology | No |
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