Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM Impact
32GB 4800MT/s DDR5 CL38 SODIMM FURY Impact
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Description
Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.
Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.
Plug N Play automatic overclocking functionality*
Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.
Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.
Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.
Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.
Additional information
| Weight | 0.04 lbs |
|---|---|
| Internal memory | 32 GB |
| Memory layout (modules x size) | 1 x 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Memory voltage | 1.1 V |
| Module configuration | 4096M x 64 |
| Country of origin | China, Taiwan |
| CAS latency | 38 |
| Width | 3.8 mm |
| Height | 30 mm |
| On-Die ECC | Yes |
| Memory data transfer rate | 4800 MT/s |
| Memory ranking | 2 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Programming power voltage (VPP) | 1.8 V |
| Lead plating | Gold |
| JEDEC standard | Yes |
| Operating temperature (T-T) | 0 – 85 °C |
| Storage temperature (T-T) | -55 – 100 °C |
| Cooling type | Heatsink |
| Depth | 69.6 mm |
| Weight | 10 g |
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Package weight | 26.72 g |
| Master (outer) case width | 196.8 mm |
| Master (outer) case length | 311.1 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 812.13 g |
| Products per master (outer) case | 25 pc(s) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
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